Thermal conductive thermoplastic
components. Compared with metal materials, thermoplastic engineering plastics have the advantages of flexible design, large structural parts can be formed, and low processing cost. Although the absolute performance of the former is low, it has widely replaced metal materials as various components in many industrial fields in the past 20 years. Engineers can adjust the flexibility of thermoplastic through formula design according to the performance of resin and filler, so that the composite material can meet the performance requirements of various designated uses, which involves improving the thermal performance of plastic materials. It is occasionally reported that it is generally only for the thermal insulation of plastic. However, at present, the demand for heat-conducting thermoplastics in the market has increased sharply. The reasons are as follows: first, in the field of electronic products, the trend is to develop towards the goal of smaller volume, lighter weight and faster calculation, which increases the difficulty for product designers to deal with the heat generated during the operation of electronic products. The faster the processor runs, the more heat the chip generates. A 486 chip releases about 5 watts of heat, while newer Pentium chips can produce more than 30 watts. If the heat generated by this kind of chip is not eliminated in time, the service life of the chip will be greatly shortened. If thermal conductive thermoplastic is used, a series of problems of chip cooling can be well solved. The market prospect of thermal conductive thermoplastic is bright. Another reason for further improving the efficiency of factor allocation and factor quality is that it not only improves the heat transfer capacity of thermoplastic, It also obtains the integration of parts and lower manufacturing cost, and can greatly extend the service life of fluorescent displays. By improving its thermal conductivity, we can use metal materials that can replace the commonly used ones in the above application fields. When discussing the application of substituting metals in heat conduction, we should first make clear the properties of materials commonly used at present and their application requirements, which shows the relative thermal conductivity of various materials. The figure occupies one place in the market, which clearly shows that thermoplastics belong to insulation and do not have the required thermal conductivity before modification. However, the thermal conductivity of metal materials is much larger than the actual requirement. Therefore, at present, when dealing with metal materials, the thermal conductivity of materials with different thermal conductivity properties is generally considered. In this case, the key is to determine the actual range of thermal conductivity of thermal conductive thermoplastic. In addition, compared with pure resin material, the thermal conductivity of the material with filler is increased by 3 times. The physical properties are not greatly affected. Table 2 nylon 6 and PP practice have proved that PMMA artificial eye is one of the most ideal methods to repair the appearance of the eye at present. Table 1 material physical properties of PPS Composite Material Performance varieties PPS glass sheet PPS glass fiber added ceramic thermal conductivity through the plate w/m.k0 31.02.2 thermal conductivity w/m.k in the plate has no surface resistivity of 1.07.0. For a simple heat exchange method, the thermal performance of materials cooled in air has been paid attention to. This paper introduces that convective heat transfer usually determines all temperature equilibrium gradients. Since convective heat transfer is the main factor, thermoplastics with thermal conductivity of 1W/m.k~10w/m.k can achieve the same transfer effect as metals. By using thermal conductive fillers, thermoplastics such as ppspa6pp can produce composites with thermal conductivity of 10W/m.k according to the formula, and their applications include manufacturing various radiators, pump casings, etc.